I’ve recently acquired a modified T962A reflow oven and have been experimenting with profiles. I’ve had to really ramp up the peak temperature and time at peak temperature to even have any chance at melting and flowing the solder paste.
In the attached pictures I believe the solder paste is burnt. How can this be avoided? As mentioned I had to really increase peak temperature, even with longer soak times and temperatures to get any sort of reflow.
EDIT: Here's a link to the solder paste in question. We've only had it for a few weeks and it's been stored within the recommended temperature range.