Looking at the datasheet for component ESD321DPYR, the PCB footprint looks something like this (copy and paste from page 16):
However, the footprint I downloaded from Library Loader here, a trusted and reputable website is quite different and looks like this:
The pins in the footprint they provided extend way beyond the outline and appear too big. I also compared against Library Expert Pro to confirm (based on dimensions I inputted from the TI datasheet) and it looks similar to the TI datasheet not the footprint supplied by Library Loader. I'm a novice at this so not sure if I'm missing something or misunderstanding things. I did send an email about this to SamacSys, the company behind Library Loader. Any help is appreciated!
Thanks all for the info. I guess I didn’t make the distinction that the “mechanical data” section is sperate and has a different purpose from the “land pattern” data section. I’ve uploaded annotated images to get some clarity.
- If I understand correctly, the mechanical data provide dimensions for the IC package itself and the pins on the IC. While the land pattern data provide info for the PCB pads. Is this correct?
- In the first new image I just added, is it correct that the arrows point to the pads and the outer perimeter of the package? Is this outer perimeter supposed to match the 1.1x0.7 size in the second new image attached, from the mechanical data section?
- In the second new image attached, the arrows in red point to the pins and not the pads? The distance between the center of the pins is max of 0.7, while the pins are max size of 0.3 by 0.55? The outer package perimeter has a max size of 1.1x 0.7?
- In the third new image, the arrows point to the pads , which have size of 0.6x0.5 and center to center spacing of 1?