Hello fellow engineers.
I am trying to make an electrical connection with some gold plating. The gold plating is shaped like a rectangle, with dimensions of 3mm x 1.5mm x 0.1μm thick. Here is what the part looks like, it's quite small.
My procedure is:
- Tin some 24 gauge stranded copper wire
- Apply flux to the gold pad
- Attempt to solder the wire to the pad
Every time I try to solder (using standard solder: 63% tin, 37% lead solder wire, flux core, 0.6mm diameter. the solder I used), I end up with a failed connection within one second of solder flow. What I mean by this is, all the gold seems to disappear, and I am left with an extra-tinned wire. I think what happens is the gold is absorbed into the solder, as Wikipedia states here.
I am wondering, how do you suggest I make a reliable electrical connection to this part?
Per comments: - Tip: Metcal STTC-144, with a MX-PS5200 PSU. I am not sure what temperature the tip is at during soldering. - Substrate: from the product description that the substrate is Si, with 0.3μm of SiO2, then 0.01μm of Cr, then 0.1μm of Au.