I want to confirm that, for a linear regulator IC, quiescent current multiplied by the input voltage accounts for the IC power dissipation(including drop-out voltage loss).
I ask because the datasheets for some of the linear regulators say that this loss is calculated by the GND pin current multiplied by the input voltage. This is found in the thermal considerations section.
While I initial thought of them as the same thing, the datasheets have different values and curves for each.
I'm doing a stress analysis on the linear regulator and want the total power loss of the IC, so which current is definitively used for the IC device dissipation; quiescent current or GND pin current?
Note: I've already calculated the power dissipation from the drop out voltage. I just want the device dissipation.
Some datasheets I was referring to: