Instead of having a heatsink directly connected to the diode, I want to have a 2 mm layer of cold rolled steel in between case and heat sink(aluminium){for waterproofing as needed in the application}.
I have taken in account of the Rth(J-C) and Rth(C-H) for the diode and the thermal resistances of the steel plate and the conductive paste.I want to check the feasibility of the design by ensuring the temperature of the junction does not cross 150 degC. By considering the thermal resistance of the steel plate, there is not much difference in the temperature of the junction with or without the steel plate.
Kindly let me know if I should consider the contact resistance between steel plate and heat sink. If yes, how to calculate the value for the same?