I'm new to SMD soldering, and tried to assemble a couple of boards, using a reflow oven. I 'm using a stencil (Kapton - mylar) and so far it worked fine except for the LQFP48 devices (pitch 0.5mm). In this case, the pins are bridged (too much paste creating short circuits between the pins). I guess the problem is too much paste in the pads, but I'm using just one pass over the stencil.
Is there any way to do this and avoid this problem? Should I reduce the IC pads area in the solder paste layer?