For a new project I am looking to use 8 layers and I am currently figuring out the layer stack I want to use. As for usage, I will most likely go with:
- GND Plane 1
- Signal 1
- Power plane 1
- Power Plane 2
- Signal 2
- GND Plane 2
And for an overall thickness of ~1.6mm (because the PCB will be plugged into a connector directly) I was thinking about using four 200um cores and three ~180um prepregs.
However, I just checked the layer stackup proposal on multi-circuit-boards. Unlike me, they did not use 4 cores and 3 prepregs, but 3 cores and 4 prepregs, with electroplated copper on the outer layers.
What are the advantages/disadvantages when using 3 or 4 cores?