I found myself needing to attach small heatsinks to Mosfets and CC power regulators. Also some high-power diodes.
Today I have learnt that thermal compounds, even best in the market, are dozens of times less conductive than aluminium or copper.
I understand thermal compound is used only to cover microscopic cracks.
But what about thermal adhesive tapes?
My question is:
Using a thermal tape, I might completely cover the surface between the heat source and the heat sink in order to join them together.
If thermal tape is 100 times less conductive than aluminium, how do they manage to do their job and transfer the heat even at high power applications?