I bought a cheap chinese infrared rework station, mainly to unsolder large QFN's or QFP's from a board. The main problem with hot air is the inability to heat large areas evenly.
I can easily remove QFN's from a board with the station. Resoldering can be difficult because the board needs to be removed from the station to position the part.
A BGA already has solder balls to connect it back to the board, a QFN does not.
My question is, can IC's other than BGA's be resoldered to the board? What is the process that is used?