I've got some question about stack-up for 4 layer PCB.
My design is rather simple but due to many connections all arround PCB it couldn't be made with 2 layer PCB, this is why I picked 4 layer board.
My PCB is 1.6mm thick, with 1oz copper on all layers (incl. internals).
I'm using 1st layer as a power/signal layer with some locals ground pours that are connected with multiple vias to inner ground plane (which is 2nd layer // and whole 2nd layer is big ground pour without any slots [excl. vias clearance]).
Question is should I use 3rd layer as a power/signal and 4th as a big ground pour? Or should I swap it and make 3rd layer as a GND and 4th as a signal/power.
Due to many connections it's not possible to place power only traces on 3rd layer and signals on 4th because there will be some slots here and there and it will make my current loop alot longer, this is why I combined power and signal to one layer. From mechanical point of view 1st and 2nd layer are adjacent do each other, similiar for 3rd and 4th.
I'm very curious which option could be better for me - I hope some of you might help ;)
PS: all component pads are located at 1st layer, there is no MCU's or any other high speed signals like clocks etc. PCB is mostly occupied with power IC's like supervisors, LDO's and some audio stuff.