I am designing a PCB to use with the AS7265x sensors. The datasheet states, on page 51:
In order to prevent interference, avoid trace routing feedthroughs with exposure directly under the AS7265x devices.
Would it be fine to use a 4-layer PCB with a middle layer for a GND pour and another with VDD? I would expect the pours to shield the ICs from any routes traced on the bottom layer (ICs on top).