I'm repairing quite the pricey device, where a strain gauge failed. It's a pressurized device, and the strain gauge measures the internal pressure by means of it. The crux of the matter is that the strain gauge goes on a small metal cylinder epoxied to the PCB itself.
To install a new one, I will need to use hot curing resin, but I want to avoid having to remove the metal cylinder to reduce risks of damage and potential surprises. This means baking the whole PCB, MCU included, which worries me a lot since I have no clue whether it could become corrupted and I can't reprogram it.
I have 3 options for hot curing with Adhesive A:
- 1 hour at 190 °C
- 3 hours at 170 °C
- 6 hours at 160 °C
And other 3 with Adhesive B:
- 30 minutes at 200 °C
- 1 hour a 180 °C
- 3 hours a 150 °C.
Now, the max storage temperature I saw in the datasheets of some ICs on the board is 125 °C which is what is deterring me from attempting this.
I found this question that basically asks the same, but I'm looking for a more formal resource if anyone has one.
I'm also thinking if there's a possibility of insulating the rest of the PCB since the topology allows it.
Thank you very much in advance.