Long time lurker first time poster. I am making a breakout for a MCU we want to prototype with and I was curious if there are design rules I should follow for these.
The datasheet for the MCU says "0.1 µF ceramic at each pin plus bulk capacitor 1 to 10 µF" for each power pin. But since I am tying all the power pins together can I get by with one or two bypass caps and a bulk cap?
I have attached images of my board layout and the datasheet section in particular.
Please ignore the silkscreen I am working on that last once placement of parts is done.