I am attempting to create a polygon that increases the area of an existing smd pad so as to make the area larger in order to hand solder. I am running into an issue removing what I believe is the thermal boundary between the polygon and the pad.
I read through a couple previous posts with similar issues:
Eagle make copper pour connect to entire smd pad
Removing pad to polygon space in eagle
the pad in question is only there to adhere the part to the board, it serves no other purpose.
I double checked that I was not using thermals when creating the polygon, then modified the footprint and removed thermals from the pad in question as well. Since then I have completely removed and re-added the part to the board, but the issue still persists.