I am attempting to create a polygon that increases the area of an existing smd pad so as to make the area larger in order to hand solder. I am running into an issue removing what I believe is the thermal boundary between the polygon and the pad.
I read through a couple previous posts with similar issues:
the pad in question is only there to adhere the part to the board, it serves no other purpose.
I double checked that I was not using thermals when creating the polygon, then modified the footprint and removed thermals from the pad in question as well. Since then I have completely removed and re-added the part to the board, but the issue still persists.