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I will be using the TMP117 in a design I'm working on, and was a bit curious to what the difference is between the different Lead/Ball finishes listed in the datasheet?

There's a choice between NIPDAU and SAC396, and I havent been able to find much information on the advantages/disadvantages betweent the two. As far as I've gathered sofar it relates mostly to the shelf life of the components, but I'm not sure about that.

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The TMP117 is available in 2 package styles:

  1. WSON (a type of DFN package) and the pins have a NiPdAu finish (this is compatible with both SnPb and lead free processes).

  2. WSBGA (a BGA package) which by definition will have solder balls and the solder balls are SAC396 which is a type of lead free solder.

There is not really any confusion; BGA devices will always have solder balls whereas other types of package rarely have any solder finish.

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SAC396 is a solder type, NiPdAu (Nickel-Palladium-Gold) is a surface finish, typically.

So, bit of a different category.

TI has a document on its NiPdAu contact finish's potential for solder embrittlement. Maybe that's of interest to you?

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