I'm considering using surface mount heat sinks for D2PAK devices on a PCB. These heat sinks are bent sheet metal frames with tin/lead plating in tape/reel packaging which are suitable for soldering directly to PCBs. I have not personally seen these types of heat sinks on production PCBs previously, but see them offered by several leading vendors.

I'm a little concerned about the thermal mass of the heatsink and the fact that it might shield the part beneath it from any infrared/radiant heat sources when running through a reflow oven.

I'd appreciate if anyone could share their experience with these devices? Any best practices or precautions?


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