# Do I need to Reduce the Width of a Power Trace for Thermal Relief When it's Passing Through a Pin on the Chip?

I'm routing a PCB. Currently, all power traces are 20 mils. A QFP chip on the board requires multiple voltage rails to operate, I found the easiest solution is passing a power trace through a pin on the chip (the 1.8VI net in the screenshot).

However, it means the trace is as wide as the pin itself. Will it acting as a heatsink and create a solderability / thermal balance problem in hand soldering or reduce the yield in reflow soldering? Should I reduce the trace width when it's passing a pin for thermal relief?

• I thought thermal relief was only for hand soldering and it isn't an issue with reflow where ambient temp is high. Can't heat sink when everything is the same temperature. I've not had problems using traces as wide as the pad when getting boards assembled via oven. May 14 '20 at 14:23
• If you have a connection to a large internal plane you end up with the suface traces hotter than the internal ones. Meaning those pins could not flow as well as the others. May 14 '20 at 15:25