Regarding CMOS analog IC layout, what are differences between DRC, DFM and DFR?
What I understood during research:
DRC (Design Rule Check) - checks if a laid out block follows technology rules what ensures dimensional precision and electrical parameters
DFM (Design For Manufacturing) - additional check on top of DRC. Additional rigorous rules to further increase yield comparing to DRC.
Depending on technology, particular check rules may be included in DRC or DFM, e.g.: antenna effect check may be in DRC or DFM of a given technology in a given foundry.
Is, what I wrote above, correct?
Additionally, what is DFR (Design For Reliability)? Is that just synonym of DFM?