Regarding CMOS analog IC layout, what are differences between DRC, DFM and DFR?

What I understood during research:

  • DRC (Design Rule Check) - checks if a laid out block follows technology rules what ensures dimensional precision and electrical parameters

  • DFM (Design For Manufacturing) - additional check on top of DRC. Additional rigorous rules to further increase yield comparing to DRC.

Depending on technology, particular check rules may be included in DRC or DFM, e.g.: antenna effect check may be in DRC or DFM of a given technology in a given foundry.

Is, what I wrote above, correct?

Additionally, what is DFR (Design For Reliability)? Is that just synonym of DFM?


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