I am designing a very small signal conditioning daughterboard with the intent of mounting it directly underneath a cylindrical piezoelectric force device/"sensor" to rectify and filter the differential voltage generated across the two pins.
The piezo device is about 60mm in diameter, and the PCB will be near the same with two through-holes for attaching the piezo device.
Thus, from the "top down" view, the footprint of the PCB will not add any new area, rather be directly under the transducer.
Having selected EMF hardened components as well as other common practices like copper pour, do you think this physical design has any glaring issues from a signal standpoint?
The transducer generates a fairly large signal at around 1.5Vpp. my main concern is some sort of capacitance issues being so close to the transducer.