Is there an electronic rule or just a rule of thumb regarding through hole solder pad dimensions?
That is, if I have a 0.025 inch diameter drill hole (suitable for 24AWG wire), what should be the total diameter of the solder pad? This is to have an appropriate surface of pad to solder on for both good electrical and mechanical properties.
What ratio should I use?
For example, x2 or x3, would give a total diameter of 0.05 and 0.075 inches respectively. Or I can try to have the same surface between the drilled hole and the soldering pad. Doing some math, that would mean taking a sqrt(2) ratio. However, that looks (at least visually) a very small surface.
Any suggestion? Or even pointer to material for good PCB design practices where that can be explained? Thank you.