I'm designing a custom 8-Layer board. The main power supply is based on a 24V-12V Iso DC-DC (Tracopower TEN 40-2412WIR). I'm a little concerned about the heat generated by this device because it's gonna be operating almost at full load in a close environment (no forced air allowed).
The datasheet of Tracopower TEN 40 specifies a non-conductive FR4 material for the baseplate: this makes me think that the device was designed to dissipate most of the heat generated by the top of the device itself (because of copper case), using a heatsink.
I'm evaluating some ways to spread as much heat as possible far from this device without a heatsink on top of it.
I was thinking about using the GND pin of the DC-DC to help conduct heat away from the converter to the main PCB, using a region outside the DC-DC in contact with the ground polygon (on the layer immediately below it). In this context, I planned to place an exposed pad to hook the convection under the Traco case, as per attached figure. It should favor the dissipation along the dedicated polygon outside the component footprint.
I don't know if it can be a good or a completely useless idea. Alternatively, are there other ways to spread heat away from the DC-DC converter?