Our company have been designing and manufacturing custom circuit boards for some 10 years now, and up till now by far the most common reason for board failure has been a mechanical shock - heavier SMD components (like inductors and such) has a tendency to simply break off the boards even with the slightest shock (like device being dropped even a mere feet from the ground).
How is this problem being handled in the mass manufactured equipment (especially devices used in vibration prone environments and vehicles)? I believe that hot-glueing every component in place is not a proper way to do this, right? Is there any epoxy coatings or something like that being done after board is soldered?