i am trying to design an efficient cooling solution for my project. I planned placing a IoT computer in an aluminum housing which is completely closed.
In this case, do I really need fins and large surface areas INSIDE the aluminium housing when my main goal is to dissipate the heat to the housing itself as fast as possible?
I'd really appreciate your help!
Here is some more information:
Ambient temperature: 25-30 degrees celsius
Max. Power: 10W
Time Period: The device is intended to work 24/7 (of course NOT with max. Power but with 20-30% of what's possible. However I think that a great product is designed to also handle 100% Power over a vast period of time!
Internal temperature: The CPU itself (surface area of 10mm x 10mm) reaches a max of 80 degrees.
Surface area of the enclosure: 0,05735 m2
Enclosure material: Aluminium sheet metal (1mm thickness)
Space between CPU and inside of the enclosure: 14mm
Maximum Volume of the Heatsink: 60cm3