I have two questions regarding routing power and ground.
With respect to power, is it generally better to flood copper planes and have one via per pin/pad connecting directly to the plane under, or is it better to branch out from one via with a star topology? Pardon the sloppy layout, but see the below images where I have three bypass capacitors and a single via in the bottom picture compared to the individual vias for each pad connecting to a pour on the top one.
Secondly, in regards to ground, I was viewing some board layouts based around RF chips that flooded all the empty spots with GND pours on top and bottom layers- what is the purpose/benefit of this? Free real estate for possible noise to couple onto?