As a PCB designer, is there a known list of advantages and disadvantages to using BGA vs. QFN packages?
Here is the list I have discovered (please correct me if they are incorrect):
- Smaller footprint
- X-ray needed for inspection
- Microvias may be needed
- Multiple layers may be needed for breakout
- Pins accessible by probe
- 1 layer needed for breakout
- Larger footprint
When a component is available in both BGA and QFN packages, what factors govern which package should be used?
Thanks in advance!