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I need to solder a WLCSP chip (FAN3852) to a DIP breakout board.
Since the WLCSP chip already has tiny solder balls, would it be possible to hold the chip in place on the breakout board with tape and then heat it with a heat gun? I'd have to monitor the surface temperature to ensure it doesn't exceed the max reflow tolerance (~260C).
Is it possible? Yes. Keep in mind its harder if you have other parts already on the board (use foil as a heat blocker). And the small size vs the heat gun's diameter and air flow speed. I've done it on a similar wlp chip using a small butane soldering iron with the heat gun option. About the diameter of a AA battery.
But overall its not a good way to do it. And especially not an easy way to do multiple at a time or repeatedly. There are other solutions you could try like a toaster oven converted for soldering or a pan etc etc but if you need to do multiple a proper hot air soldering station is used.
Alternatively, you can solder to it dead bug style. A 6 pin WLP like that is easy (relatively) to solder to with some spare wire as there would be no overlapping. Still not a walk in the park though. http://dangerousprototypes.com/blog/2012/11/15/fine-pitch-bga-deadbug-soldering/
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