This is regarding the adjacent mirror image formed over the ground plane by a PCB antenna during operation. Take the first image of the IFA with the ground plane highlighted in yellow on layer 2, the top signal layer is hidden in the image. Say I have some through-hole components or vias to other layers which would punch holes in the second layer ground plane as shown.
Now take the second photo of the antenna image mirrored over the ground plane as it would be during operation. Do these holes in the ground plane where the mirror image is forming have any effect on the function or effectiveness of the antenna, or degrade the performance at all?