I'm in the middle of placing components on my first 4-Layer PCB. Layers are Sig-GND-Vcc-Sig. I2C/SPI/UART, up to 20MHz MCU, nothing exceptionally fancy.
I have decided to check with the community whether I'm doing things right. I use small polygon pours with a pair of vias for the ground connection for small groups of decoupling or bulk caps, so I was wondering if I'm doing it right. Because if not, I better restart while I still haven't wasted too much time on doomed layout.
Here is an example of my boost converter, output of which is supposed to go down to the power plane (which doesn't take the entire layer, but bigger rectangular part of it).
The boost converter itself is this: Datasheet (if anyone wants to have a look; I need 1A at most).
Please, roast my layout and tell me why this is bad and how can I improve it (I don't expect it to be good considering I'm losing 4-layer virginity here). Thank you.