So I'm designing a 2-layer PCB consisting of a bunch of ICs (op-amps, OTAs) and passive components. I would like to have my decoupling caps (little 100nF axial) as close to my op-amps as possible, so I've have the following thoughts.
My op-amp sockets are mounted on the front-layer of the board and will be soldered from the back layer, as per normal. My first thought was to mount the decoupling caps directly under the op-amp socket, but on the back layer (with pins poking through the front-layer), then solder them from the front layer.
But after some more thinking I don't think this will work, since the soldered pins of the caps would be sticking up directly under the op-amp socket, and might not make the header sit flush or flat on the front-layer, depending on the final soldered pin height.
Here's my solution to this. Mount the caps on the back layer and solder them from the back layer, then just pre-cut the cap pins so they don't poke through into the front layer. Two questions about this however:
Do PCB makers (JLCPCB in my case) put soldering pads on both sides of a through-hole board or just the opposite side of where a component is mounted?
Is it good practice to solder passive components on the same side they are mounted?
For reference, here's a Kicad pic of what I was thinking, in terms of mounting (TL074 on front side, caps on back side):