I am trying to choose an SMD SIM card holder for my PCB but while doing so noticed a few inconsistencies for the C1-C8 locations on a product's footprint. It has got me wondering if all SIM cards and holders use the same locations for C1-C8 on their footprints. Like, for example, is the location of Vcc (C1) standardized for both the card and card holder?
TE Connectivity's 1981959-1 is the component in question.
If I look at the datasheet I find the diagram below for SIM card contacts and corresponding pads on the component's footprint.
If I go on Mouser and download the SamacSYS (2nd image below) footprint I see that the location of C4 is on the back-row of the contact pads instead of on the front with C1-C3.
This has gotten me confused. I am guessing this is just an error on the SamacSYS footprint.
Can I expect that the SIM card I am using was designed with the SIM card pin assignment below? That is C1, C2, C3 are Vcc, RST and CLK respectively and so on?