I have a 2 PCB layer. Bottom and Top layer are used for signals and power and the remaining area is copper ground.
I read about EMI etc and I decided to go to 4 layers for reduced EMI.
I realized now that actually it does not make any big difference since I read that the Top and Bottom can be used and the inner ones will be ground planes. So I cannot technically use more layers to separate high speed signals with analog and digital signals and power line etc.
Do I miss something?
Also, why isn't enough the copper ground and they suggest to have plane layers in between bottom and top? Should those layers in between, be copper ground or not?