Altium tries to approximate circles where it doesn't need to.
I have a polygon pour with some vias inside, associated to the same net. The connection style is "direct connection" so the copper should be continuous between the pour region and the via pad.
Altium approximates a circle with zero distance between them in the polygon which results in an imperfect connection that impacts both thermal and electrical resistance:
Reducing the arc approximation settings in polygon properties makes the connection better but doesn't solve the problem entirely. The imperfection is more obvious if the board is manufactured with relatively low standards.
- Why doesn't it pour over the pad smoothly?
- How should I make proper via connections to polygons?
I can make it a clean connection by increasing the via pad size by a notch, AFTER I've poured the polygon, so it over-covers the copper, but the next pour and it happens again. That's not a "solution" for sure.