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I have a board with several designs, one component did not arrive so half of the PCB cannot be fabricated. In order not to waste time I would like to manufacture the designs that can be done but I don't know if the FR4 or the layers could be affected.

The PCB is 1mm thick and has 4 layers.

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    \$\begingroup\$ I'd be less worried about the PCB itself than about the components you're planning to put through the heat cycle multiple times. \$\endgroup\$ Jul 13 at 8:31
  • \$\begingroup\$ the specific boards I can manufacture can be removed after the reflow, son only the PCB itself would be under heat more than once. \$\endgroup\$ Jul 14 at 11:13

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