I am designing the thermal outline plane of this current amplifier ic in a 4 layer board using Eagle Pro. This board will be made using ENIG process.
After spent so much time trying to understand in the datasheet
(https://www.mouser.com/datasheet/2/256/MAX9920-1514342.pdf) if the exposed pad should or should not be connected to ground I decided to ask someone here with experience on those ic's and what are the best practices in this scenarios.
If you look at page 14, the drawing says something about exposed pad soldering but below in the pin description ic talks about "contiguous ground plane" that's for me is kind of confusing of which info should I take.
What I don't want is make a low-impedance short in the circuit because of a wrong connection of the exposed pad.