I am searching for a reliable wire-to-board connection. The wire is 0.1 mm enamelled wire. The wire is solderable, but the polymer is very temperature resistant and needs to be mechanically removed before the soldering process. Currently we are mechanically removing the polymer and then soldering the wire to the board. However, some of the solder joints fail later on, although visually they look fine and also measuring the the resistance of the critical joints does not show any hint of an unreliable joint. We even started doing a HF measurement to maybe catch suspicious joints (looks promising), but it is a lot of effort for every system. Some joints fail during the next production steps, some fail over a period of 3 months.
So I am searching for alternatives - either to improve the soldering process or to have a completely different connection method (crimping?). Any ideas?