I am learning Cadsoft Eagle and have noticed that the pads for SMT devices are on the 'top'/'bottom' display layer, whereas the pads for THT components are on the 'pads' layer. Why is this?
I have enlarged the pads for the SMT device so that I don't commit Seppuku with my iron during hand production. Looking at the soldermask 'stop' layer, it appears that all is well, as the SMT pads are not covered. I just want to check that this difference between SMT/THT pads is correct before making my first batch of coffee coasters.