First, I see a couple of components (C22, Z6) suspiciously close to the board edge.
For low cost, volume assembly you will want to pick-n-place the parts onto the boards while they are still panelized. Then the individual boards will be cut out of the panel with a pizza-cutter-like tool. This can cause local stress on parts near the board edge and end up damaging them. Ceramic capacitors are particularly susceptible to this type of damage.
Alternative singulation methods are available, but my understanding is that the "pizza cutter" is the lowest cost.
Second, I suspect that your parts placement is generally too tight to get the best pricing for pick&place. Generally I expect to see the spacing between two-terminal passives (0603 or 0805 packages, for example) nearly equal to the size of the components themselves. The spacing between U2 and RTC and CONN7 in particular looks problematic for pick & place and for re-work. The body of other components should be outside the bounding box of the U2 pads to be able to get a soldering iron fixture down onto all the U2 pads at once for rework.
Third, depending on how the assembly will be done, pay special attention to the SMT parts on the backside of the board. For the lowest cost, you might want to keep all SMT off the backside of the board, even if it means making the board a little bit bigger. If you do need to put SMT on the bottom side, keep all SMT parts well away (like 1/4" or more) from all through hole pads. This will enable a selective wave process to attach the through-hole parts and avoid the need for gluing the SMT parts down for wave processing.