I just recently discovered (the hard way...) that VSSOP-8 is an ambiguous IC package name. Some manufacturers use this name to describe a 0.65mm pitch device, whereas others use VSSOP-8 to describe a narrower 0.5mm pitch device. TI may even use both package sizes under the same name, requiring the user to double check which they mean in a device's datasheet.
As a result of this, I am in the process of auditing my PCB footprint libraries for IC footprints.
What are some other known ambiguous IC package names? I know that some SOIC-8 parts are wide whereas others are narrow, but are there others? Are any of the SMD IC package names unambiguous? Is there a longer, more official way to name these device packages to eliminate ambiguity (e.g., VSSOP-8,p0.5 for a 0.5mm pitch VSSOP-8)? Is there a standards organization like JEDEC that "governs" these package names?