So I've got a design in which I would like to use the AT25SF321B-MHB-T chip by Dialog Semiconductors, but its datasheet does not mention whether the exposed thermal pad should be connected to ground or not.
Their documentation is lacking in general, for example, no information provided as to recommended land pattern/footprints. Funny thing is that their website, doesn't have any mention of the AT25SF321B-MHB-T whatsoever, thus no step files to be found either.
Does anyone have experience with the UDFN package and their exposed pad?
As far as I know, these are generally connected to ground on the PCB for most effective thermal relief, but I've also had cases where the datasheet says to specifically leave the exposed pad unconnected.