I am designing a two layer PCB with high speed signals with rise and fall times as low as 3ns.
I was doing some studying and learned that for better signal intergrity and EMI a good grounding strategy is critial. To lower the effects of displacment current lowering crosstalk, routing a ground element along with each high speed tracks helps. May it be a ground plane underneath or ground track along side it. (Do correct me if I am wrong with my understanding.)
Would it be a better strategy to have both layers as ground plane? A ground plane forces a return path next to most signals. Stitching vias make for even better return paths.
Is there any other benefits to having power and ground plane? I understand that this strategy has the advantage of creating decoupling capacitence.
EDIT: What is meant by 2 ground planes, I actually meant Signal-Ground/Signal-Ground. AND What is meant by 1-power 1-ground planes, I actually meant Signal-Power/Signal-Ground.