The formula below demonstrates the relationship between power absorbed and thermal resistance. I feel confused.
Won't adding more heatsink result in higher junction temperature according to the formula below?
Since junction temperature is the product of power absorbed times thermal resistance of the system plus ambient temperature(air), adding more heatsink only increases the thermal resistance of the system, since thermal resistance is adds up like a series resistance in resistor.
I'm considering the case with only junction thermal resistance and casing thermal resistance as compared to the one with added thermal resistance due to a heatsink.