At our company, we are manufacturing a PCBA with a thickness of 0.8mm. After applying solder paste at the pad position of the through hole, we attach the PTH component before transferring it to the reflow oven.
It seems that the position still lacks solder, we have to touch-up manually to fill this position.
Do you have a solution for this problem?
For sure, we've been using hand soldering after the SMT process, but that's also what I wanted to improve the process, I learned the paste-in-hole method. Does it work, please give me advice.
I am planning to change the sweeper angle from 45° to 60°.They say it will have more solder in the hole but will also be more dangerous for the stencil and PCB.