I am trying to understand the technical justification to have a keepout region around the 2 large outer pads of a Molex connector (PN# 5055670881).
I would like to have more area around these outer shield pads to add some vias for strengthening the vertical connection through the board structure.
One other thread on the internet mentioned something about a ‘solder keepout layer within a trace for a connector’ to help with pulling the connector down flat to the board. I am not sure that is the same reasoning for this type of connector because the KO region is in a totally different area…
Any insight would be great!