For double layer circuit boards, providing your schematic does not contain RF circuitry at frequencies much above 100MHz, a general guideline that I adopt is to try and make one side of the circuit a ground-plane and route as much as you can on the component layer. When it comes to DC power tracks feed power to the parts of the circuit that take the most current first then tee-off to the less-hungry circuits.
For instance if it were a power amp for an audio application feed power to the main output stage first - this means that when you tee-off to circuits that handle smaller signals there is no current in those tracks that are used by the power transistors.
Daisy chaining the power is therefore something that you can't avoid in these situations. If you have sensitive analogue circuits and digital circuits try and avoid ground-planes becoming contaminated by splitting the ground plane at the point where digital meets analogue such as at an analogue to digital converter.
Without more detailed knowledge of the circuit it is impossible to be more specific; if the circuit topography suits sending power lines down a specific area of the board then do so but be aware of sending large currents further than they need to be sent i.e. minimize the track lengths carrying these currents.
Mount IC caps as close to the power pins as possible is a general rule and tie them directly into the ground-plane.
A better way is to use more layers but many, many circuits don't need that level of sophistication.