Dual In-Line, as applicable to IC packages, is a standard, with the pin pitch of each row being 0.1 inch, and the separation between rows (the dual part) being 0.3 inches (JEDEC MS-001) for small pin count packages.
There is also a 0.6 inch row separation DIL package (JEDEC MS-010), for large pin counts. These are commonly known as Wide-DIP ICs.
The nRF device shown is not actually a standard IC package, it just uses a standard pitch 0.1" pin pitch (along both axes) connector. It is not designed to fit into a DIP IC socket. Instead, one would use a dual-row female pin header if soldering onto a board is not desired:
Edit: I just found out that apparently there are also less common 0.4 inch and 0.9 inch row separation packages, though I have never seen one. Also known are 0.75 inch row spacing packages with a 0.07 inch pin pitch.