I understood your question in the way how to get it routed with this particular footprint, and not in the way how it "works" in general, so I did not care for trace width - tried just to get as much as possible.
The drain pin is a bit hard to get to on this component, though it is available on the case as well. If you want the component not laying flat on the board, and thus we can only use pin 2, I'd go somehow like this way:
This allows (ridiculous) trace width but of course can not be soldered by hand except with a very fat soldering iron.
Here the width of the traces to pin 2 would be (2.4 + 2.2)mm so 4.6 mm in total - that might be enough - and it can be as wide as you want outwards. I combined top and bottom layers (here each 7 mm wide traces on both top and bottom on each pin, to show there is no limit).
If you need a heat sink on the component mind that the case pin is on drain voltage!
The vias make it even harder to hand solder and might not be needed that near to the component, but somewhere you would need to stitch the two layers used for D and S.
Sometimes it is possible to put enough solder paste on the pads of such THT components to let the reflow process make the hard work for you. For this to work you might need some handdraw solder stop and solder paste openings - and of course an idea to hold the component during reflow, but it may be worth the effort.
It could be another interesting question to calculate how much solder paste area would be needed to get nice connections of such TO-packages by reflow soldering...