In this device, on page 208, the page has the Package outline drawing. 8-pin package. SOIC.
"8S2, 8-lead, 0.208” Body, Plastic Small Outline Package (EIAJ)"
I want the footprint of this device.
Hence, I checked this PDF, which has the packages and footprints.
While searching for the footprint in the second pdf, I couldn't find a 8-pin SOIC footprint. However, there was 8-pin SOIJ package. You can find the footprint on page 162 on the second PDF.
My question is, whether the land pattern/footprint on the second pdf is the right one for the package mentioned in the 208 page of the first pdf?