How to properly place thermal vias under components? I hook them up to the ground net, the same as the ground pad of my QFN component, but they don't seem to connect. Do I need to edit the footprint or can I somehow just add them on the fly to my design?
edit: I tried adding them to the foorprint. I made the original SMD type square pad smaller, added pads around for thermal vias and coated everything with a rectangle. All of the thermal vias and the centre pad are connected to ground GND_9. The problem is that no holes are visible in the via, so I think they won't be on the board!