I've read this question and in its comments it is said:
LDO and IC heatsinks will generally have a very different answer then computer motherboard heat sink. This question really doesn't belong here
What I'm asking is how to use coolers with IC packages. For example let's say I have a device in TO220 package which according to my calculations needs cooling. How would I cool it? Most obvious answer is of course using a cooler, but that part isn't very clear to me.
I've seen that sometimes heatsink is directly connected to the package by a screw but sometimes insulator is used to prevent direct contact between screw and package. Some other times, heat conductive insulator is used together with insulator for screw to prevent direct contact between package and heatsink.
Sometimes silicon paste is used and sometimes it isn't. How would I determine when it is needed and when it isn't needed? My experience with computers tells me to always use it.
I've also seen silicon pastes marketed as for use in electronics. How are they different that ones used in computers? Would thermal pastes for computers work well with ICs?