What is the right design rules from JLCPCB? When I look at the electrical clearance from JLCPCB, I find:
- Via to Via (Same net labels): 0.254mm
- Hole to hole (Different net labels): 0.5mm
- Pad to pad (Different net labels): 0.127mm
- Pad to Pad with hole (Different net labels): 0.5mm
- Via to track: 0.254 mm
- Plated Hole to track: 0.33mm
- Non Plated Hole to track: 0.254mm
- Pad to track: 0.2mm
- Minimum spacning: 0.09mm (4-6 layers)
https://jlcpcb.com/capabilities/pcb-capabilities
Question:
Are these the correct settings of the design rules?
Issue:
The issue is that it seems like a regular BGA footprint cannot even be produced by JLCPCB with those design rules. I have downloaded a sample CAD model from STMicroelectronics and it seems that all the rules from that model violate the JLCPCB rules. Is that correct?